Ibond5000-dual

Author: tiuf

August undefined, 2024

IBond5000-Dual Wire Bonders PBT

WebbIBond5000-Manual Wedge Wire Bonder. IBond5000-Wedge基本規格; 外觀尺寸 (Dimensions) 680mm(W)x700mm(D)x530mm(H) Webb6 feb. 2024 · 本公司生产销售引线键合机等，还有更多引线键合机相关的最新专业产品参数、实时报价、市场行情、优质商品批发、供应厂家等信息。您还可以在平台免费查询报 … ottotipo per vicino

IBond5000-Dual Poloautomatické kontaktovačky PBT

WebbThe fine wire wedge bond sequence for both manual and automatic equipment can be explained in eight steps: STEP 1: RESET / REST / IDLE: Wire is located under the bonding tool between surfaces (chip or lead). STEP 2: FIRST SEARCH: Tool descends to first bond search height for final positional (X, Y) adjustment. STEP 3: FIRST BOND: Tool brought ... WebbThe iBond5000 Dual ball and wedge wire bonder is an advanced convertible wedge and ball bonder used for process development, production, research, and supplemental manufacturing support. The iBond5000 Dual enables ball and wedge wire bonder fine aluminum and gold wire wedge or ribbon bonding utilizing a deep access wire feed … Webb20 juni 2024 · The MPP iBond5000 series integrates the proven MWB mechanical design with an advanced graphic user interface. iBond5000 main control board is based on … イクスピアリランチ

Ibond5000-dual

Webb13 jan. 2024 · The iBond5000 Dual enables fine aluminum and gold wire wedge or ribbon bonding. A Patented N-EFO generates the ball bond for gold or copper ball bonding and a unique swing arm simplifies changeover between modes. Modes include: Ball, bump and wedge bonding gold wires: 17-70 microns diameter. Wedge bonding aluminum wires: … WebbBall, Bump & Wedge bonding gold wires: 17-70 microns dia. Wedge Bonding Aluminium Wires: 20-75 microns dia. Ball bonding copper wires: 17-50 microns dia. Ribbon …

Did you know?

Webb13 apr. 2024 · 小型で、研究開発や少量生産に活躍. 『マニュアルワイヤボンダ iBond5000シリーズ』は、. 国内で400台以上の納入実績を誇る「4500シリーズ」の … Webb23 mars 2024 · MPP球楔一体多功能引线键合机以色列KS手动半自动焊线机 IBOND 5000 -Dual 产品特性：手动半自动加工定制：是品牌： MPP 型号： iBond5000-Dual 电源电压： 220 功率： 1.3-2.5

WebbiBond5000-Dual 球焊/楔焊多功能引线键合机 iBonder5000球焊引线键合机 iBond5000手动楔焊引线键合机. 产品特点 7” TFT Touch Screen Management Cortex A9 Dual-Core CPU-based hardware system Windows CE-based management software USB connectivity - External Mouse, Keyboard, Disk on Key WebbiBond5000-Dual是球焊及楔焊二合一焊线机，功能多样，可用于制程开发、生产、科研，并可对制造过程提供更多支持，适用于混合电路/MCM多芯片模块、COB 板装芯片、 …

WebbThe iBond5000-Dual is an advanced ball/wedge bonder used for process development, production, research or added manufacturing support. The iBond5000 provides the high … WebbiBond5000 Dual是业界一款先进的兼容楔焊和球焊的多功能引线键合机，广泛用于工艺开发、生产、研发和生产制造备用等应用场景。. 使用深腔引线供料系统，iBond5000 Dual多功能键合机能楔焊细线径的铝线、金线和带状线材。. 借助独特的N-EFO专利技术，该键合 …

Webbbond5000 是一台先进的球焊/楔焊一体机，可以为工艺研发，生产制造或者附加制造提供有力的技术支持。. 每种键合应用的高收率和优异的重复性，包括：光学器件、MCM 多 …

WebbIBond5000-Dual je pokročilý kuličkový / klínový kontaktovací systém používaný pro přímou výrobu obvodů, vývoj procesů, výzkum nebo podporu výroby. IBond5000 poskytuje vysokou výtěžnost a vynikající opakovatelnost potřebnou pro každou aplikaci při kontaktování oběma metodami a různorodými materiály drátu. イクスピアリレストラン予約WebbWith over 30 years of wire bonding experience the current range of MPP manual wire bonder’s include the i5000B Ball Bonder, i5000W Wedge Bonder and i5000D Dual Bonder, which has both ball bonding and deep access wedge bonding capabilities. The equipment is used for process development, production or research of microelectronic … イクスピアリロッカー何時からWebb6 feb. 2024 · 本公司生产销售引线键合机等，还有更多引线键合机相关的最新专业产品参数、实时报价、市场行情、优质商品批发、供应厂家等信息。您还可以在平台免费查询报价、发布询价信息、查找商机等。イクスピアリレストラン子連れWebbIBond 5000 楔焊键合机是一款先进的楔焊键合机，可以为工艺研发，生产制造或者附加制造提供有力的技术支持。. 亮点：. 整体解决方案 – 机器、工具、应用程序开发、服务. … イクスピアリレストラン営業時間はWebb13 jan. 2024 · Our clients love the flexibility of the iBond5000 Dual Ball and Wedge Wire Bonder! This powerful system performs wedge-wedge and ball-wedge bonding on the … イクスピアリレストラン誕生日WebbBall, Bump & Wedge bonding gold wires: 17-70 microns dia. Wedge Bonding Aluminium Wires: 20-75 microns dia. Ball bonding copper wires: 17-50 microns dia. Ribbon Bonding: 25 x 250 micron gold ribbon. An internal bonding profiles library, which includes a bonding wires database, further enhances the ease of use and caters for various applications. ottotipo stampabileWebb9 jan. 2024 · See More Relevant Products. iBond5000-Dual Wire Bonder. manual operational modes, the Model 4524 supports a variety of applications including Hybrid/MCM, Opto-devices, Microwave and Discrete devices. ffering versatile production capabilities with the industry’s best value, K&S’ Model 4524 Manual Ball Bonder … otto tippelt